JPH03102765U - - Google Patents
Info
- Publication number
- JPH03102765U JPH03102765U JP1154890U JP1154890U JPH03102765U JP H03102765 U JPH03102765 U JP H03102765U JP 1154890 U JP1154890 U JP 1154890U JP 1154890 U JP1154890 U JP 1154890U JP H03102765 U JPH03102765 U JP H03102765U
- Authority
- JP
- Japan
- Prior art keywords
- flat package
- mounting
- land
- copper foil
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1154890U JPH03102765U (en]) | 1990-02-09 | 1990-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1154890U JPH03102765U (en]) | 1990-02-09 | 1990-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102765U true JPH03102765U (en]) | 1991-10-25 |
Family
ID=31515071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1154890U Pending JPH03102765U (en]) | 1990-02-09 | 1990-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102765U (en]) |
-
1990
- 1990-02-09 JP JP1154890U patent/JPH03102765U/ja active Pending